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| 發(fā)布時(shí)間：2010.07.29 |
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摘要： 爆板也叫分層，是PCB制造與裝配一個(gè)常見問題，在有鉛焊接也經(jīng)常出現(xiàn)，涉及影響因素很多，板材，PCB制造過程和裝配過程都存在一定影響因素。目前，業(yè)界已普遍采用無鉛焊接，爆板問題更為突出。如何防范該問題的發(fā)生，必須從各個(gè)環(huán)節(jié)進(jìn)行預(yù)防與改善。本文根據(jù)日常經(jīng)驗(yàn)進(jìn)行整理，供大家參考。
關(guān)鍵詞：無鉛焊接 爆板 應(yīng)力 粘結(jié)強(qiáng)度 耐熱性
Abstract：Delamination is a common problem during PCB assembly process even for tin lead assembly, many factors including the raw material, PCB manufacturing process and the soldering process might cause delamination. Nowadays, it’s more critical as lead free soldering become more and more popular , how to prevent and improve the related process? How to better understand the problem, for your good reference. this article we collect and summarize some information according to our experience
Keywords：Lead free soldering Delamination Stress Bonding strength Heat resistance |
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